Comparator circuit having latching behavior and digital output sensors therefrom

ABSTRACT

A digital output sensor includes a sensing structure that outputs a differential sensing signal and includes at least one sensing element. An integrated circuit includes a substrate including signal conditioning circuitry for conditioning the sensing signal that includes a differential amplifier coupled to receive the sensing signal and provide first and second differential outputs and a comparator having input transistors coupled to receive outputs from the differential amplifier. The comparator also includes first and second current-mirror loads that provide differential drive currents and are coupled to the input transistors in a cross coupled configuration to provide hysteresis. An output driver is coupled to receive the differential drive currents. An output stage includes at least one output transistor which is coupled to the output driver for providing a digital output for the sensor. A voltage regulator is coupled to receive a supply voltage and output at least one regulated supply voltage.

This patent application is a Divisional of U.S. patent application Ser.No. 12/196,979, entitled “COMPARATOR CIRCUIT HAVING LATCHING BEHAVIORAND DIGITAL OUTPUT SENSORS THEREFROM” which was filed on Aug. 22, 2008,the disclosure of which is incorporated herein by reference in itsentirety.

FIELD OF THE INVENTION

Embodiments of the invention relate to digital output sensors, and moreparticularly integrated circuit-based digital output sensors.

BACKGROUND

Sensors are used to sense a variety of different quantities. Forexample, the quantity or parameter to be sensed can be a magnetic field,a current, a temperature, a pressure or a position. Commonly usedsensing structures include piezoelectric elements positioned on orformed in a flexible diaphragm for sensing pressure, electricallyconducting or semiconducting elements based on the Hall effect,magnetoresistance or variable reluctance structures for sensing magneticfields.

Hall sensors are one form of magnetic field sensor that can bemanufactured at low cost particularly when embodied as an integrated(monolithic) sensor. When a current-carrying conductor or semiconductingHall element is placed into a magnetic field, a voltage will begenerated orthogonal to the direction of both the current and themagnetic field. This principle is known as the Hall effect.

The Hall element is generally constructed from a thin sheet ofconductive or semiconducting material with output connectionsperpendicular to the direction of current flow. When subjected to amagnetic field, the Hall element responds with an output voltageproportional to the magnetic flux density. The output voltage isgenerally very small (on the order of several μV) and thus requireselectronics to provide gain to achieve useful signal levels. When theHall element is combined with the associated signal processing sensorelectronics, it forms a Hall effect sensor. Integrated Hall effectsensors comprise an integrated circuit chip (e.g. silicon) that containsthe Hall element and the signal conditioning electronics.

Analog sensors provide an analog output voltage which is proportional tothe magnitude of the magnetic field input (sensed). Conventional digitaloutput Hall sensors use a Schmitt trigger or other hysteresis-generatingcircuitry to convert the basic analog output sensor to a digital outputsensor. The output of a digital sensor is one of two binary levels, 1 or0 (ON or OFF). The Schmitt trigger or other equivalenthysteresis-generating circuit is operable to convert the analog outputof the amplifier, that is coupled to the Hall elements, into a binaryoutput level, 1 or 0 (ON or OFF) and to provide a reasonable noisemargin between the sensed binary states.

Supply voltage rejection and temperature compensation are importantperformance characteristics for sensors such as integrated Hall sensors.For example, digital output Hall sensors require these characteristicsto control the amount of change in the magnetic transition points, thatdefine the binary output states, over operating ranges of both supplyvoltage and temperature.

A common technique for obtaining supply voltage rejection is to includea voltage regulator to provide a stable bias for the Hall element andthe signal processing circuitry. It is also desirable for the regulatedvoltage provided by the voltage regulator to be nearly constant overtemperature, to provide a reference for temperature compensation. Thetrade-offs in using precision on-chip voltage regulation is larger diesize/cost and additional supply current. Driven primarily by commercialHall market pricing, specifications and die size constraints imposed bycontemporary surface mount packages, a need exists for having a smalldie size that operates at lower power and also provides competitivemagnetic specifications.

SUMMARY

This Summary is provided to comply with 37 C.F.R. §1.73, presenting asummary of the invention to briefly indicate the nature and substance ofthe invention. It is submitted with the understanding that it will notbe used to interpret or limit the scope or meaning of the claims.

Embodiments of the present invention describe new comparator circuitryoperable to receive a differential input signal and provide adifferential output signal and digital output sensors therefrom. Thecomparator circuits described herein utilize internal positive feedbackto provide the hysteretic relationship between the sensed binary signallevels, thus avoiding the need in conventional designs for a pair ofSchmitt triggers or the need for a feedback loop to the amplifier stagethat precedes the comparator. Comparators according to embodiments ofthe invention also provide new temperature compensation and supplyvoltage rejection circuitry. These aspects lower power requirements andreduce die size, thereby reducing the cost of the sensor. Comparatorsaccording to embodiments of the invention can be embodied as balancedcircuitry that comprises two identical half circuits (and thus has fullsymmetry).

Digital output sensors according to embodiments of the invention includea sensing structure comprising at least one sensing element. The sensingstructure outputs a differential sensing signal. An integrated circuitincludes a substrate including signal conditioning circuitry forconditioning the sensing signal. The sensing structure can also be onthe same substrate for a fully monolithic sensor embodiment.

The signal conditioning circuitry includes a differential amplifiercoupled to receive the sensing signal and provide first and seconddifferential outputs, and a comparator having input transistors coupledto receive outputs from the differential amplifier. The comparatorincludes first and second input transistors, coupled to first and secondcurrent-mirror loads that are cross coupled to achieve high gain,wherein the current-mirror loads provide differential feedback currentsto the emitters of the input transistors in a cross coupledconfiguration. The first and second input transistor emitters arecoupled to first and second resistors, wherein feedback current from thecurrent-mirror loads produces an offset voltage that must be overcome bythe input signal to the comparator in order for the comparator to switchstates. When the comparator switches, the states of the current-mirrorloads are reversed (e.g. one saturated and one off) so that the feedbackcurrent, hence the offset voltage, is switched from one side of theinput stage to the other, thereby providing hysteresis that results innoise margin between the sensed binary states. The first and secondcurrent-mirror loads also provide differential drive currents. An outputdriver is coupled to receive the differential drive currents. An outputstage comprises at least one output transistor which is coupled to theoutput driver for providing a digital output for the sensor. A voltageregulator is coupled to receive a supply voltage (VS) and output atleast one regulated supply voltage (VREG), wherein the regulated supplyvoltage is coupled to the sensing structure, the differential amplifierand the comparator.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an integrated circuit including a digitaloutput sensor according to an embodiment of the invention.

FIG. 2 is a circuit schematic for implementing one exemplary digitaloutput sensor embodiment, according to another embodiment of theinvention.

FIG. 3 is a circuit schematic for the voltage regulator shown in FIG. 2,according to an embodiment of the invention.

FIG. 4 is a circuit schematic for the current regulator embodied as athermal-voltage (V_(T)) referenced current regulator shown in FIG. 2,according to an embodiment of the invention.

FIG. 5 is a circuit schematic for the differential amplifier coupled toa sensor element that is shown as a Hall element in FIG. 2, according toan embodiment of the invention.

FIG. 6 is a circuit schematic for the comparator with hysteresis alongwith its associated current regulator, shown as anepitaxial-resistor-referenced current regulator in FIG. 2, according toan embodiment of the invention.

FIG. 7 is a circuit schematic for the output driver shown connected toan open collector NPN output transistor in FIG. 2, according to anembodiment of the invention.

DETAILED DESCRIPTION

The present invention is described with reference to the attachedfigures, wherein like reference numerals are used throughout the figuresto designate similar or equivalent elements. The figures are not drawnto scale and they are provided merely to illustrate the instantinvention. Several aspects of the invention are described below withreference to example applications for illustration. It should beunderstood that numerous specific details, relationships, and methodsare set forth to provide a full understanding of the invention. Onehaving ordinary skill in the relevant art, however, will readilyrecognize that the invention can be practiced without one or more of thespecific details or with other methods. In other instances, well-knownstructures or operations are not shown in detail to avoid obscuring theinvention. The present invention is not limited by the illustratedordering of acts or events, as some acts may occur in different ordersand/or concurrently with other acts or events. Furthermore, not allillustrated acts or events are required to implement a methodology inaccordance with the present invention.

Embodiments of the invention describe new comparator circuitry havingcurrent-mirror loads which receive differential inputs and providedifferential drive currents, and digital output sensors therefrom.Embodied as a Hall effect sensor, embodiments of the present inventionreplace conventional Schmitt trigger and interstage feedback baseddigital output sensors with sensors based on comparator circuitry havinginternal feedback for the hysteresis function. Comparator circuitryaccording to embodiments of the invention provide a compact, fullydifferential design having latching behavior, temperature compensationand an output driver interface for the digital output sensor, availablefrom circuitry generally with reduced complexity and thus reduced diesize. Sensors according to embodiments of the invention provide highlevels of supply voltage rejection as well as high levels of temperaturestability through new bias configurations that are described below.Other portions of the signal processing electronics help provide acompact sensor design, such as the voltage regulator design as describedbelow.

Referring to FIG. 1, a block diagram of an integrated circuit 100including a digital output sensor 110 according to an embodiment of theinvention is shown. One specific embodiment for implementing the digitaloutput sensor 110 is shown in the schematic described below relative toFIG. 2. All references below to transistor level circuitry generallyrefer to FIG. 2.

The IC 100 comprises a substrate 101 upon which the digital outputsensor 110 which comprises signal conditioning circuitry forconditioning sensing signals is formed, generally using conventionalintegrated circuit processing (lithography, etching, ion implantation,diffusion, deposition (e.g. (LPCVD)). The substrate 101 can comprise asilicon substrate (silicon chip). The sensor 110 includes a sensingstructure comprising at least one sensing element 105. Although thesensing element 105 is shown formed on the substrate 101, in otherembodiments of the invention the sensing structure can be formedoff-chip.

The sensing structure can comprise single element or bridge-type orother balanced output sensor types. One embodiment comprises a flexiblediaphragm having a plurality of piezoresistive elements within orcoupled to the diaphragm. Other example embodiments of the inventioninclude one or a plurality of Hall elements, or one or a plurality ofmagnetoresistive elements.

The sensing structure is operable to output a differential sensingsignal 106, 107. The signal conditioning circuitry includes adifferential amplifier 115 coupled to receive the differential sensingsignals 106, 107 and provide first and second differential outputs 116and 117. A second current regulator 150 (acting as a current sink) isshown coupled to the differential amplifier 115.

A comparator with hysteresis 120 having input transistors (See Q27 andQ28 in FIG. 2) is coupled to receive voltage outputs 116 and 117provided by the differential amplifier 115. A first current regulator155 is shown coupled to the comparator 120. As described below, thefirst current regulator 155 can be embodied as anepitaxial-resistor-referenced current regulator.

In one embodiment, the comparator 120 comprises internal feedbackcircuitry comprising a first current-mirror load (Q19, Q21) coupled to acollector of the first input transistor Q27 cross coupled to a secondcurrent mirror load (Q20, Q22) which is coupled to a collector of thesecond input transistor Q28. This cross coupling arrangement achieveshigh gain. In this particular embodiment, hysteresis is provided bycoupling outputs of the first and second current-mirror loadsrespectively to the emitters of the second and first input transistors(a cross coupled configuration) and with first input transistor Q27emitter coupled to first emitter resistor R7, second input transistorQ28 emitter coupled to second emitter resistor R8, first and secondemitter resistors coupled together at a connection node to first currentregulator 155. The first and second current-mirror loads providedifferential drive currents shown as 121 and 122.

An output driver 125 is coupled to receive the differential drivecurrents 121 and 122. An output stage includes at least one outputtransistor 130, shown in FIG. 1 as an open collector NPN transistor 130,coupled to receive base drive from the output driver 125 to provide adigital output 135 for sensor 110.

A voltage regulator 140 receives a supply voltage VS and outputs atleast one regulated supply voltage, shown as a first supply voltage VREGand a second supply voltage VR. VR can be at a higher level as comparedto VREG. As shown in FIG. 1, VREG is shown coupled to the sensingstructure 105 and the differential amplifier 115, while VR is showncoupled to the comparator 120. VS is shown coupled to the output driver125. Voltage regulator 140 also comprises a voltage reference circuitthat can include startup circuitry for providing startup current for thesecond current regulator 150.

FIG. 2 is a circuit schematic for implementing one exemplary digitaloutput sensor 200 embodiment, according to another embodiment of theinvention. The blocks shown in FIG. 1 comprising voltage regulator 140,second current regulator 150, differential amplifier 115 coupled to thesensor element 105 (shown as a Hall element), comparator 120, firstcurrent regulator 155, output driver 125, and output transistor 130, areall identified in FIG. 2. The operation of the respective blocks shownin FIG. 2 is described in more detail below.

FIG. 3 is a circuit schematic for voltage regulator 140 shown in FIG. 2,according to an embodiment of the invention. Voltage regulator 140 isshown outputting voltages VR and VREG, where VR is about oneforward-biased diode voltage (V_(BE)) above VREG (the V_(BE) of Q5).This dual supply level feature is helpful for operation at low supplyvoltage and low temperature, by providing higher supply voltages to onlythe circuitry requiring the higher supply voltage (thus reducing theoverall power dissipated). Upon power-up, current flows throughresistors R3 and R12 to Q2 and Q3 which together with R1 comprise aV_(BE) referenced current source. Regulated current flowing in Q2 alsoflows through Q1 which is shown as a lateral PNP which is connected as acurrent-mirror having dual outputs. A first mirrored current from Q1flows through a voltage reference comprising Q7, Q8, Q9 and R11. Q7 andQ8 also comprise a current divider to source a small start-up current,shown as ISU, into the second current regulator 150 which is shown inFIG. 2 as a V_(T) referenced current source. A second mirrored currentfrom Q1 provides current to Q5 and Q6. Q6 provides shunt regulation forVR at the base terminal of Q5. Q5 provides series pass regulation forVREG. Q4 is shown as a diode-connected transistor that blockspotentially destructive currents in the event that VS is negative withrespect to the supply voltage reference (GND). R10 limits potentiallydestructive currents through Q2 during an electrostatic discharge (ESD)event across VS and GND.

FIG. 4 is a circuit schematic for the second current regulator 150embodied as a V_(T) referenced current regulator 150 as shown in FIG. 2,according to an embodiment of the invention. Upon power-up, start upcurrent (ISU) from voltage regulator circuit 140 is supplied to thecollector/base of Q12 and the bases of Q13 and Q17, then collectorcurrent from Q13 provides bias to Q10 and Q11 which are connected as acurrent-mirror, thereby completing a positive feedback loop, commonlyreferred to as self bias. Q12 and Q17 are mirror connected, so that Q17sinks a regulated bias current shown as IREG1 from the differentialamplifier 115. This bias technique provides the V_(T) referencedcurrent, which in one embodiment is approximately V_(T)*ln3/R2, whereV_(T)=k*T/q; k is Boltzmann's constant, T is the temperature and q isthe magnitude of an electronic charge.

FIG. 5 is a circuit schematic for differential amplifier 115 coupled tothe sensor element 105 that is shown as a Hall sensor in FIG. 2,according to an embodiment of the invention. The V_(T) referencedcurrent, shown as IREG1 from the second current regulator 150 embodiedas a V_(T) referenced current regulator 150, is coupled to the emittersof Q15 and Q16. Collectors of Q15 and Q16 are coupled to load resistorsR4 and R5, respectively. Q15 and Q16 are a matched pair, as areresistors R4 and R5. Differential outputs VA and VB are shown from thecollectors of Q15 and Q16, respectively. Q18 provides a bias levelshift. The small-signal voltage gain (A_(V)) of the differentialamplifier 115 can be expressed as A_(V)≈gm*R4, with R4=R5. A_(V) is thendirectly proportional to R4 and inversely proportional to R2,A_(V)≈n3*R4/(2*R2), and this functional dependence can be used toprovide temperature compensation as described below.

FIG. 6 is a circuit schematic for the comparator with hysteresis 120along with the current regulator 155 shown in FIG. 2, according to anembodiment of the invention. As described above, comparator 120 includesfirst and second input transistors Q27 and Q28 which are coupled toreceive differential outputs 116 (VA) and 117 (VB) from the differentialamplifier 115. The comparator 120 comprises internal feedback circuitrycomprising a first current-mirror load (Q19, Q21) coupled to a collectorof first input transistor Q27, cross coupled to a second current-mirrorload (Q22, Q20) which is coupled to a collector of the second inputtransistor Q28. Emitter degeneration resistors R7 and R8 are showncoupled to the emitters of Q27 and Q28, respectively. The current-mirrorloads (Q19, Q21) and (Q20, Q22) are cross-coupled to emitterdegeneration resistors R7 and R8 to provide a hysteresis voltage (ΔV)for comparator 120, which is described in more detail below. Q19 of thefirst current-mirror load provides the first differential output currentIO1, while Q20 of the second current-mirror load (Q20, Q22) provides theother differential output current IO2.

Comparator 120 can be seen to be a balanced circuit that providesdifferential input and output (is fully differential), and is shownembodied as two identical half circuits (thus has full symmetry).Comparator 120 is shown having identical first and second half circuits,the first half circuit comprising said first input transistor Q27, thefirst current-mirror load (Q19, Q21) and the first emitter degenerationresistor R7, while the second half circuit comprises the second inputtransistor Q28, the second current-mirror load (Q20, Q22) and the secondemitter degeneration resistor R8.

The current-mirror loads are cross-coupled to emitter degenerationresistors R7 and R8 to provide a hysteresis voltage (ΔV) at the switchpoints for comparator 120, defined as the differential voltage measuredat the emitters of Q27 and Q28 (ΔV=VQ27 _(E)−VQ28 _(E)). In the case ofthe sensing elements 105 being Hall sensors, where V_(H) is the biasvoltage across the Hall element, ΔV≈(V_(H)/N)·(R7/R6), where the valueof N depends on the ratio of collector currents of Q27 and Q28 to themirrored feedback currents into emitter resistors R7 and R8, and also onthe ratio between input and output currents of the first currentregulator 155. R6 is referred to herein as a matching resistor forreasons made clear below. First current regulator 155 comprises matchingresistor R6, and transistors Q23 and Q24. Matching resistor R6 deliversinput current to transistors Q23 and Q24 which are connected as acurrent-mirror, and can be scaled to set the ratio of output currentflowing in the collector of Q24 to the input current flowing through R6.The output current of first current regulator 155 is also the biascurrent for comparator 120. Matching resistor R6 is coupled to VREG sothat the voltage across R6 is approximately equal to the voltage acrossthe sensing element 105 shown as a Hall element 105. This arrangementreduces the magnetic operate and release sensitivity to VREG, becausethe sensing signal (106, 107) from Hall element 105 and the hysteresisvoltage (ΔV) are both proportional to VREG.

The regulated voltage VR from voltage regulator 140 is shown coupled tothe emitters of the current-mirror load transistors (Q19, Q21 and Q22,Q20). These current-mirror load transistors are shown embodied asmulti-collector lateral PNPs, wherein the first and secondcurrent-mirror loads provide differential drive currents 121 (IO1) and122 (IO2).

FIG. 7 is a circuit schematic for the output driver 125, according to anembodiment of the invention, shown connected to open collector NPNoutput transistor 130. Driver 125 receives currents IO1 and IO2 fromcomparator 120. Operation of output transistor 130 (shown as Q33) iscontrolled by IO2 sourced into the base of Q29, which then operates Q30to provide the required drive current to the base of Q33. The drivecurrent flowing through R9 produces a voltage drop that is sensed by Q31which regulates the drive current by limiting the amount of IO2available to the base of Q29. The positive temperature coefficient of R9acting together with the negative temperature coefficient of thebase-emitter voltage of Q31 produce higher drive current at lowtemperature to compensate for the reduction in current gain of Q33 atlow temperature. Shut-off of Q33 is controlled by IO1 sourcing currentto Q25 and Q26 which are connected as a current-mirror. Q26 shuts offQ29 and subsequently, the drive current for Q33. Current exiting theemitters of Q25 and Q26 source current into the base of Q32, whichprovides rapid shut off of Q33. Resistors R13 and R14 ensure adequateshut off of Q30 and Q32 respectively.

It is generally desirable for a digital magnetic sensor to have magneticswitch points and hysteresis that have minimal change over the operatingtemperature range for the sensor. According to an embodiment of theinvention, temperature dependencies of the sensed signal voltage fromsensing element 105 such as a Hall element 105, the voltage gain of thedifferential amplifier 115 and the hysteresis voltage of the comparator120 can be combined in a manner that provides cancellation of thedependencies. The temperature compensation of the sensor magneticparameters resulting from such combination is herein described asrelating to an embodiment comprising a silicon-based integrated circuit,based on bipolar technology with an n-type epitaxial layer.

The magnetic hysteresis (ΔB) of sensor circuit 200 as shown in FIG. 2 isproportional to the hysteresis voltage of comparator 120, expressedabove as ΔV≈(V_(H)/N)·(R7/R6). ΔB is inversely proportional to both themagnetic responsivity (R_(H)) of Hall element 105 and the voltage gain(A_(V)) of differential amplifier 115, giving ΔB≈ΔV/(R_(H)*A_(V)) whereR_(H) is in S.I. units of volts/tesla. R_(H) can be described asR_(H)≈V_(H)*μH*G/λ where: V_(H) is the Hall cell bias voltage, μH is theHall mobility including the Hall scattering factor and the G/λ ratiorepresents a dimensionless constant, dependent on a particular Hallelement geometry. Partial temperature compensation of the differentialamplifier gain is apparent from the transconductance (gm), expressed asgm≈IREG1/(2*V_(T)), with IREG1≈V_(T)*ln3/R2 or gm≈ln3/(2*R2), whereV_(T) cancels out leaving only the temperature coefficient of R2 in thedenominator.

As described above, the small-signal voltage gain (A_(V)) of thedifferential amplifier can be expressed as A_(V)≈gm*R4, with R4=R5.A_(V) is then directly proportional to R4 and inversely proportional toR2; A_(V)≈ln3*R4/(2*R2). Expanding the above equation for the magnetichysteresis gives ΔB≈(V_(H)/N)*(R7/R6)/((V_(H)*μH*G/λ)*(ln3*R4/(2*R2))from which: V_(H) cancels out, temperature coefficients of R4 and R7cancel based on close matching provided by being fabricated from thesame diffused layer and the temperature coefficient of matching resistorR6 will cancel the temperature coefficient inherent in the Hall mobility(μH), that is due to the bulk conductivity of the n-type epitaxial (epi)layer comprising the Hall element, if R6 also is fabricated from thesame epi layer. With the exception of the temperature coefficients of R2and the Hall mobility scattering parameter, all temperature coefficientshave been shown to directly cancel out in the expression for ΔB.However, temperature coefficient canceling can be further improved. Forexample, R2 can be fabricated from a particular diffused, p-type layerso that the negative temperature coefficient of the p-type layerconductivity will nearly cancel the positive temperature coefficient ofthe Hall mobility scattering factor over a wide temperature range. Insuch an arrangement, the temperature compensation of ΔB for sensorcircuit 200 becomes nearly ideal.

Comparators according to embodiments of the invention are useful for avariety of digital output applications that require processingdifferential inputs to provide digital outputs having hysteresis.Embodied as a Hall sensor, sensors according to embodiments of theinvention generally achieve latching performance with 50 Gauss typicaloperate and release, do not require resistor trimming to achievemagnetic latching performance, and generally operate respectively overvoltage and temperature ranges of from 3 to 24 volts and −40 to 150° C.Sensor according to embodiments of the invention are generally reversebattery protected as described above and will generally fit into lowcost packages, such as a SOT-23W package.

Embodiments of the invention can be integrated into a variety of processflows to form a variety of devices and related products. Exemplarydevices and products besides magnetic field sensors such as position andcurrent sensors include temperature, and pressure sensors.

The semiconductor substrates may include various elements therein and/orlayers thereon. These can include barrier layers, other dielectriclayers, device structures, active elements and passive elementsincluding source regions, drain regions, bases, emitters, collectors,conductive lines, conductive vias, etc. Moreover, although the inventionhas generally been described using bipolar transistors, embodiments ofthe invention can utilize a variety of other processes including CMOS,BiCMOS and MEMS.

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only, and not limitation. Numerous changes to the disclosedembodiments can be made in accordance with the disclosure herein withoutdeparting from the spirit or scope of the invention. Thus, the breadthand scope of the present invention should not be limited by any of theabove described embodiments. Rather, the scope of the invention shouldbe defined in accordance with the following claims and theirequivalents.

Although the invention has been illustrated and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others skilled in the art upon the reading andunderstanding of this specification and the annexed drawings. Inaddition, while a particular feature of the invention may have beendisclosed with respect to only one of several implementations, suchfeature may be combined with one or more other features of the otherimplementations as may be desired and advantageous for any given orparticular application.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. Furthermore, to the extent that the terms “including”,“includes”, “having”, “has”, “with”, or variants thereof are used ineither the detailed description and/or the claims, such terms areintended to be inclusive in a manner similar to the term “comprising.”

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

The Abstract of the Disclosure is provided to comply with 37 C.F.R.§1.72(b), requiring an abstract that will allow the reader to quicklyascertain the nature of the technical disclosure. It is submitted withthe understanding that it will not be used to interpret or limit thescope or meaning of the following claims.

1. A digital output sensor, comprising: a sensing structure comprisingat least one sensing element, said sensing structure outputting adifferential sensing signal, and an integrated circuit comprising asubstrate including signal conditioning circuitry for conditioning saidsensing signal, said signal conditioning circuitry comprising: adifferential amplifier coupled to receive said sensing signal andprovide first and second differential outputs; a comparator having inputtransistors coupled to receive outputs from said differential amplifier,said comparator comprising first and second current-mirror loads coupledto said input transistors in a cross coupled configuration to providehysteresis, said first and second current-mirror loads providingdifferential drive currents; an output driver coupled to receive saiddifferential drive currents; an output stage comprising at least oneoutput transistor coupled to said output driver for providing a digitaloutput for said sensor, and a voltage regulator coupled to receive asupply voltage and output at least one regulated supply voltage, saidregulated supply voltage coupled to said sensing structure, saiddifferential amplifier and said comparator.
 2. The digital output sensorof claim 1, wherein said input transistors comprise first and secondinput transistors, said first current-mirror load coupled to a collectorof said first input transistor and said second current-mirror loadcoupled to a collector of said second input transistor.
 3. The digitaloutput sensor of claim 1, wherein said comparator further comprises afirst current regulator, said first current regulator comprising amatching resistor that is coupled to said regulated supply voltage and acurrent mirror coupled to said matching resistor, wherein said currentmirror is coupled to provide bias current for said comparator, wherein avoltage across said matching resistor is approximately equal to avoltage across said sensing structure.
 4. The digital output sensor ofclaim 3, wherein said first current regulator provides a temperaturecoefficient having a reciprocal relationship within a transfer functionfor magnetic hysteresis of said digital output sensor relative to atemperature coefficient of said differential sensing signal provided bysaid sensing structure, and a coefficient of said regulated supplyvoltage has a reciprocal relationship within said transfer function to acoefficient of said regulated supply voltage of said differentialsensing signal provided by said sensing structure.
 5. The digital outputsensor of claim 1, further comprising a second current regulator coupledto said differential amplifier, said second current regulator comprisinga V_(T) referenced current regulator.
 6. The digital output sensor ofclaim 5, wherein said voltage regulator includes start up circuitry thatgenerates startup current, wherein said startup current is coupled tosaid V_(T) referenced current regulator.
 7. The digital output sensor ofclaim 2, wherein said first current-mirror load is cross coupled to anemitter of said second input transistor and said second current-mirrorload is cross coupled to an emitter of said first input transistor. 8.The digital output sensor of claim 7, wherein said comparator furthercomprises a first current regulator that provides: a temperaturecoefficient having a reciprocal relationship within a transfer functionfor magnetic hysteresis of said digital output sensor to a temperaturecoefficient of said differential sensing signal provided by said sensingstructure; a coefficient of said regulated supply voltage having areciprocal relationship within said transfer function to a coefficientof said regulated supply voltage of said differential sensing signalprovided by said sensing structure, and first and second resistorscoupled between said emitters of said first and said second inputtransistors and said first current regulator.
 9. The digital outputsensor of claim 1, further comprising cross coupling between said firstcurrent-mirror load and said second current-mirror load.
 10. The digitaloutput sensor of claim 1, wherein said first and second current mirrorloads each comprise multi-collector pnp transistors.
 11. The digitaloutput sensor of claim 10, wherein said multi-collector pnp transistorscomprise lateral pnp transistors.
 12. The digital output sensor of claim1, wherein said output stage is an open-collector output stage thatreceives current-regulated base drive from said output driver.
 13. Thedigital output sensor of claim 1, wherein said at least one regulatedsupply voltage comprises a first regulated supply voltage and a secondregulated supply voltage higher than said first regulated supplyvoltage, wherein said second regulated supply voltage is coupled to saidcomparator and said first regulated supply voltage is coupled to saidsensing structure and said differential amplifier.
 14. The digitaloutput sensor of claim 1, wherein said sensing structure comprises adiaphragm and a plurality of piezoresistive elements coupled to saiddiaphragm, a plurality of Hall elements, or a plurality ofmagnetoresistive elements.
 15. The digital output sensor of claim 1,wherein said sensing structure is formed on said substrate, whereby saiddigital output sensor is a fully monolithic sensor.
 16. An integrateddigital output Hall effect sensor, comprising: an integrated circuitcomprising a silicon substrate; a sensing structure comprising at leastone Hall element in or on said substrate, said sensing structureoutputting a differential output sensing signal, and signal conditioningcircuitry for conditioning said sensing signal, said signal conditioningcircuitry comprising: a differential amplifier coupled to receive saidsensing signal and provide first and second differential outputs, saiddifferential amplifier coupled to a V_(T) referenced current regulator;a comparator having input transistors comprising first and second inputtransistors coupled to receive outputs from said differential amplifier,said comparator comprising first and second current-mirror loads coupledto said input transistors in a cross coupled configuration to providehysteresis, said first and second current-mirror loads providingdifferential drive currents, wherein said first current-mirror load iscoupled to a collector of said first input transistor and said secondcurrent-mirror load is coupled to a collector of said second inputtransistor; a resistor-referenced current regulator coupled to providebias current for said comparator that provides a temperature coefficienthaving a reciprocal relationship within a transfer function for magnetichysteresis of said digital output sensor to a temperature coefficient ofsaid differential sensing signal coupled to said comparator, saidresistor-referenced current regulator also providing a coefficient ofsaid regulated supply voltage having a reciprocal relationship withinsaid transfer function to a coefficient of said regulated supply voltageof said differential sensing signal; an output driver coupled to receivesaid differential drive currents; an output stage coupled to said outputdriver providing a digital output for said sensor, wherein said outputstage is an open-collector output stage that receives current-regulatedbase drive from said output driver, and a voltage regulator forreceiving a supply voltage and outputting at least one regulated supplyvoltage, said regulated supply voltage coupled to said sensingstructure, said differential amplifier and said comparator, wherein saidvoltage regulator includes start up circuitry that generates startupcurrent, wherein said startup current is coupled to said V_(T)referenced current regulator.
 17. The Hall effect sensor of claim 16,wherein said cross coupled configuration comprises said firstcurrent-mirror load cross coupled to an emitter of said second inputtransistor and said second current-mirror load cross coupled to anemitter of said first input transistor, further comprising first andsecond resistors coupled between said emitters of said first and saidsecond input transistors and said resistor-referenced current regulator.18. The Hall effect sensor of claim 17, further comprising crosscoupling between said first current-mirror load and said secondcurrent-mirror load.
 19. The Hall effect sensor of claim 18, whereinsaid cross coupling between said first current-mirror load and saidsecond current-mirror load comprises a coupling of a common base of saidfirst current-mirror load to a collector of a transistor of said secondcurrent-mirror load and a coupling of a common base of said secondcurrent-mirror load to a collector of a transistor of said firstcurrent-mirror load.
 20. The Hall effect sensor of claim 16, whereinsaid first and a second current-mirror loads each comprisemulti-collector lateral pnp transistors.
 21. The Hall effect sensor ofclaim 16, wherein said at least one regulated supply voltage comprises afirst regulated supply voltage and a second regulated supply voltagehigher than said first regulated supply voltage, wherein said secondregulated supply voltage is coupled to said comparator and said firstregulated supply voltage is coupled to said sensing structure and saiddifferential amplifier.